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HyPELignum - Making Greener Electronics using Wood Materials





Introduction

In an era where consumer electronics are ubiquitous and e-waste is piling up at an alarming rate, the need for sustainable solutions has never been more pressing. Enter HyPELignum, an EU-funded project, led by RISE in Sweden and with 11 partners, that aims to revolutionize the consumer electronics industry by integrating wood-based materials and additive manufacturing techniques. This article delves into the intricacies of the HyPELignum project, offering insights for product managers, designers, and engineers in consumer electronics who are keen on making their products greener and more sustainable.



The Problem Landscape

Consumer electronics have become an integral part of our lives, but their environmental impact is often overlooked. The rapid growth in demand for these gadgets has led to an increase in electronic waste, which poses significant challenges for waste management and environmental sustainability. According to the Global E-Waste Monitor, approximately 53.6 million metric tons of e-waste was generated worldwide in 2019, a number that is expected to grow by 8% annually.


The HyPELignum Solution





A Holistic Approach

HyPELignum aims to tackle these challenges head-on by proposing a holistic approach to the design and manufacturing of electronics. The project focuses on the entire lifecycle of a product, from the sourcing of raw materials to its end-of-life stage. The ultimate goal is to manufacture net-zero carbon electronics, thereby contributing to a more sustainable economy and society.


Core Components

  • Wood-Derived Materials: The project explores the use of wood and wood-waste-derived materials as core components for substrates and ink in additive manufacturing.

  • Conductive Inks: HyPELignum is developing conductive inks based on abundant transition metals, which are less harmful to the environment compared to rare earth metals commonly used in electronics.

  • Additive Manufacturing: The project is pioneering processes for the additive manufacturing of electronic components, including sensors, communication units, and energy storage devices.

  • Energy-Efficient Microchips: A focus on developing energy-efficient microchips for systems management is also part of the project's scope.

  • Recycling and Recovery: New methods for recycling wood and recovering electronic materials are being explored, making the products more circular.

  • Sustainability Analysis: Tools for life cycle analysis, toxicity assessment, and biodegradability are being developed to aid in the design of green electronics.

Planned Demonstrators

  • EcoPCBs: Two types of eco-friendly printed circuit boards (PCBs) are being developed—3D-eco-PCB and Plywood-eco-PCB. The former uses inkjet printing on fiberwood substrates, while the latter employs wood veneers as support substrates for screen printing.


  • Integration of Sensors and actuators within large area wooden construction elements Additive manufacturing of sensors and actuators onto timber construction materials.



  • Sensorised Furniture: IoT-enabled furniture that can sense air quality and monitor office occupation is in the pipeline.



  • Covalent Adaptable Networks (CAN): Novel coating formulations based on CAN will act as degradable layers between the wood substrates and the printed electronics, facilitating easier recycling.



Implications for Stakeholders

For Product Managers

Understanding the holistic approach of HyPELignum can help in conceptualizing products that are not just innovative but also sustainable. The project offers a blueprint for integrating sustainability into the product lifecycle.


For Designers

The use of wood-based materials opens up new avenues for aesthetic and functional design. The project also provides insights into the use of sustainable materials like abundant transition metals.


For Engineers

The project offers a plethora of opportunities in additive manufacturing, material science, and electronics. Engineers can delve into the technical aspects of conductive inks, energy-efficient microchips, and sustainable materials.


Call to Action

The HyPELignum project is not just a research initiative; it's a call to action for the entire consumer electronics industry. It offers a viable path toward sustainability, urging stakeholders to rethink their approach to product design and manufacturing.


Further Reading

For more information and updates, visit the HyPELignum website.


Conclusion

The HyPELignum project is a groundbreaking initiative that has the potential to redefine the consumer electronics landscape. By focusing on sustainability from a holistic perspective, it offers a comprehensive solution to some of the most pressing environmental challenges of our time. For product managers, designers, and engineers committed to sustainability, HyPELignum serves as an invaluable resource and a catalyst for change.


Note: The data and facts presented in this article are based on the information available from the HyPELignum project as of 2023. All images are also from the project website.


Contact Person



Valerio Beni, valerio.beni@ri.se

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